Semitron ESD PEEK: Static-Dissipative for Semiconductor
Published: 2026-06-02
Carbon-nanotube-filled for ESD protection (10^6-10^9 Ω/sq). ESD damage costs K-50K per wafer at advanced nodes. Outgassing
Carbon-nanotube-filled for ESD protection (10^6-10^9 Ω/sq). ESD damage costs K-50K per wafer at advanced nodes. Outgassing <0.1% TML. For semiconductor wafer handling in vacuum chambers.
Technical Properties
| Density | 1.41 g/cm³ |
|---|---|
| Tensile Strength | 95 MPa |
| Melting Point | 343 °C |
| Shrinkage Rate | 0.3-0.7% |
| Flexural Modulus | 4.5 GPa |
| Hdt | 250 °C |
Engineering Tool: Shrinkage & Cost Estimator
Calculate part weight, mold cavity dimensions accounting for shrinkage, and material cost — all locally in your browser.
Equivalents & Cross-References
| Equivalent / Alternate | Action |
|---|---|
| Semitron ESD 480 |
Frequently Asked Questions
ESD level?
Surface resistivity 10^6-10^9 Ω/sq — static-dissipative range. Prevents both ESD events AND dielectric breakdown risk.
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References & Industry Standards
- ASTM International. Standard Specifications for Engineering Plastics & Thermoplastics. astm.org
- UL Prospector. Plastics & Elastomers Material Database. ulprospector.com
- MatWeb. Material Property Data for Engineering Thermoplastics. matweb.com
- ISO 1043. Plastics — Symbols and Abbreviated Terms. iso.org