LCP Vectra: Properties, Uses & Cost Guide
Tensile data verified against MatWeb.com database & manufacturer datasheets · Last updated July 2026
Published: 2026-06-04
LCP Vectra E130i is a 30% glass-fiber reinforced liquid crystal polymer specifically formulated for ultra-fine-pitch electronic connectors. Its near-zero flow-direction shrinkage (0.05-0.15%) enables molding of connectors with 0.3mm pitch at wall...
LCP Vectra E130i is a 30% glass-fiber reinforced liquid crystal polymer specifically formulated for ultra-fine-pitch electronic connectors. Its near-zero flow-direction shrinkage (0.05-0.15%) enables molding of connectors with 0.3mm pitch at wall thicknesses as low as 0.15mm — geometries that are impossible with any other thermoplastic. The glass fiber reduces the extreme anisotropy of unfilled LCP while maintaining the exceptional flowability that defines LCP processing.
Recommended Applications
LCP Vectra E130i is commonly specified for:
⚠ Not Recommended For
LCP Vectra E130i is not recommended for:
- Applications requiring isotropic mechanical properties (LCP is highly anisotropic — strength in flow direction is 3-5× transverse)
- Large thick-wall parts (LCP weld lines in thick sections are weak)
- Applications requiring high impact resistance (LCP is brittle in transverse direction)
Selection & Application Guide
LCP (Liquid Crystal Polymer) excels in ultra-thin-wall precision molding for electronic connectors and micro-molding applications where other polymers cannot fill the cavity. Choose LCP when wall thickness is below 0.5mm, when extremely high flow is needed for complex thin-wall parts, or when the application requires soldering resistance (up to 260°C short-term for lead-free reflow). LCP's anisotropic properties and high cost limit its use to specialized electronic applications.
Real-World Applications
LCP's exceptional flow into thin-wall sections (0.2mm wall) and resistance to lead-free solder reflow (260°C peak) make it the standard for surface-mount connectors, SIM card sockets, and USB-C connectors.
LCP's low dielectric constant (2.9) and low dissipation factor (0.002) at high frequencies suit it for 5G antenna modules and high-frequency circuit substrates.
LCP's micro-molding capability produces thin-wall, high-precision catheter tips and medical micro-components with tight tolerances and biocompatibility.
LCP withstands under-hood temperatures and provides the dimensional stability needed for precision sensor housings exposed to thermal cycling and vibration.
Processing & Cost Considerations
Manufacturing Tips
- LCP has extraordinarily low melt viscosity — it flows like water at processing temperature. This enables filling of extremely thin-wall sections but also means LCP will flash through the tiniest mold gaps. Precision mold construction with tight parting lines is essential.
- LCP's properties are highly anisotropic — strength and modulus are 3-5× higher in the flow direction than transverse. Gate location and fill pattern must be carefully designed to align the strong direction with load-bearing axes.
- Minimal drying is required (2-3 hours at 120-140°C) as LCP absorbs very little moisture. Over-drying can cause material degradation and discoloration.
LCP is expensive at $30-80/kg, justified by its unique thin-wall molding capability that no other polymer can match. The high flow allows molding of parts with 0.2mm walls that would be impossible with PPS or PEEK, potentially enabling smaller, lighter, and less expensive end products. LCP molding cycles are very fast (5-15 seconds) due to rapid crystallization, partially offsetting the material cost premium.
Technical Properties
| Density | 1.61 g/cm³ |
|---|---|
| Tensile Strength | 150 MPa |
| Melting Point | 335 °C |
| Shrinkage Rate | 0.05-0.15% (flow) / 0.3-0.5% (transverse) |
| Flexural Modulus | 15 GPa |
| Hdt | 275 °C at 1.82 MPa |
| Continuous Service Temp | 240 °C |
Engineering Tool: Shrinkage & Cost Estimator
Calculate part weight, mold cavity dimensions accounting for shrinkage, and material cost — all locally in your browser.
Equivalents & Cross-References
| Equivalent / Alternate | Action |
|---|---|
| Celanese Vectra E130i | |
| Sumitomo SumikaSuper E6000 | |
| Solvay Xydar G-930 |
Frequently Asked Questions
What connector pitches require LCP vs PPS?
LCP E130i is required for connectors with pitch ≤0.5mm and wall thickness ≤0.25mm. PPS GF40 can handle pitch ≥1.0mm with walls ≥0.4mm. The economic crossover is at approximately 0.5mm pitch — below this, LCP is required regardless of cost; above it, PPS offers comparable performance at lower material cost.
Can LCP be used for structural components?
Not recommended. LCP's anisotropic properties mean strength varies dramatically with direction — it is very strong along the flow direction but weak perpendicular to it. This makes LCP unsuitable for structural components with multi-axial loading. Use PPS or PEEK for structural high-temperature applications.
What makes LCP different from other high-temperature polymers?
LCP's molecular chains are rigid rods that self-organize into ordered domains in the melt state — this is the 'liquid crystal' behavior. This gives LCP its extraordinary flow (lowest melt viscosity of any engineering plastic) and rapid crystallization. No other polymer can fill thin-wall sections as effectively as LCP.
Is LCP suitable for microwave/RF applications?
Yes. LCP has one of the lowest dielectric constants (2.9) and dissipation factors (0.002) among engineering plastics, and these properties are stable across a wide frequency range (up to 110 GHz). This makes LCP the material of choice for 5G, millimeter-wave, and high-frequency RF components.
What is the difference between LCP Type I, II, and III?
LCP Type I (Vectra A) has the highest heat resistance (HDT 280°C+), Type II (Vectra E) balances heat resistance and weld strength, and Type III offers improved weld line strength at somewhat lower temperatures. For SMT soldering applications, Type I is standard. Type II is chosen when weld line integrity is critical.
Can LCP be painted or metallized?
Yes. LCP surfaces can be metallized by sputtering, evaporation, or electroless plating for EMI shielding and circuit traces. Surface preparation (plasma etching or chemical etching) is required for adequate adhesion. LCP's chemical resistance makes adhesion challenging without proper surface treatment.
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References & Industry Standards
- ASTM International. Standard Specifications for Engineering Plastics & Thermoplastics. astm.org
- UL Prospector. Plastics & Elastomers Material Database. ulprospector.com
- MatWeb. Material Property Data for Engineering Thermoplastics. matweb.com
- ISO 1043. Plastics — Symbols and Abbreviated Terms. iso.org